Mechanical Engineer at Intel Bangalore, IN

Job Description

As a matrix-member of the Datacenter Thermal Mechanical Components group, TMC, you will be in a position to make important contributions by leading the development of CPU, SoC & GPU enabling in support of datacenter specific mechanical solutions.

Candidate will be responsible for the development of thermal/mechanical solutions for various server, workstation, and cloud market segments, as well as working with a team of cross site architects, mechanical, thermal and electrical engineers. In this position, you will design and analyze mechanical systems, equipment and packaging. Conduct feasibility studies and testing on new and modified designs. Direct support personnel in the preparation of detailed design, design testing and prototype fabrication. Provide design information to drafting for packaging and tech marketing documentation

Qualifications

Candidate must have a minimum BS 8+ yrs, MS 6+ yrs, PhD 4+ in Mechanical Engineering in the following areas: - Mechanical design experience with Creo or SolidWorks - New product development - Working with ASME Y15.4M drawing Tolerancing standards - GD&T - Statistical tolerance analysis and theoretical DPM prediction - FMEA risk assessment - Requirements management - Execution of validation test plans - Demonstrated experience in common manufacturing design processes such as: sheet metal forming, plastic injection molding, machining, die casting, cold forming, metal injection molding, etc. - Demonstrated experience leading world-wide complex product development - Strong communication and collaboration skills are required

Working knowledge or experience with the following is a plus: - Component level structural analysis - Computer layouts and basic architecture. - Fundamental heat transfer processes conduction/convection. - Material science - Project management and team leadership - CAD data management software Windchill - General lab testing procedures such as basic instrumentation, data acquisition, fixture design, data analysis JMP, etc.

Ability to travel to China on a regular basis will be required
Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Legal Disclaimer

Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel’s offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at www.jobs.intel.com and not fall prey to unscrupulous elements.

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Seniority level

Entry level

Industry

Electrical/Electronic Manufacturing, Information Technology and Services, Computer Software

Employment type

Full-time

Job functions

Engineering, Information Technology